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ADVANCED RESEARCH PUBLICATIONS

Journal of Advanced Research in Semiconductor Technology and Circuits

Published by: Advanced Research Publications
Frequency: Bi-Annual
Subscriber Type :-
Bibliographic Information
Publishing Year: 2025
Origin: India
Language: English

About the journal

The Journal of Advanced Research in Semiconductor Technology and Circuits (JARSTC) is a peer-reviewed international journal dedicated to advancing the field of semiconductor technology, electronic circuits, and related systems. It aims to provide a comprehensive platform for the dissemination of cutting-edge research and innovations in the design, fabrication, and application of semiconductor materials, devices, circuits, and systems. The journal fosters interdisciplinary research in these fields, highlighting advancements that have the potential to impact industries such as electronics, telecommunications, energy, healthcare, and beyond.

The journal focuses on the exploration of new materials, device structures, manufacturing techniques, and circuit architectures that drive the evolution of semiconductor technologies. It welcomes contributions from both fundamental and applied research, with an emphasis on novel ideas and solutions that address the current and future challenges of the semiconductor industry.

Scope:

  1. Semiconductor Materials and Fabrication:
    • Novel semiconductor materials, including wide bandgap materials, organic semiconductors, and two-dimensional materials (e.g., graphene, transition metal dichalcogenides)
    • Advanced material characterization techniques and their applications
    • Materials for optoelectronics, power electronics, and flexible electronics
    • Techniques for high-performance and low-cost semiconductor fabrication
    • Advanced doping, deposition, and etching technologies
    • Low-dimensional materials and nanostructures in semiconductor devices
  2. Semiconductor Devices:
    • Development and characterization of novel semiconductor devices such as transistors, diodes, and sensors
    • High-performance power semiconductor devices for energy applications
    • Semiconductor-based optoelectronic devices (e.g., LEDs, lasers, photodetectors, solar cells)
    • Emerging devices, including memristors, spintronics, quantum dots, and tunneling devices
    • Advanced fabrication techniques for nanoscale semiconductor devices
    • Reliability and degradation mechanisms of semiconductor devices
  3. Integrated Circuits and Systems:
    • Design, modeling, and simulation of integrated circuits (ICs) for various applications (e.g., RF, analog, digital, mixed-signal)
    • VLSI (Very Large-Scale Integration) design and circuit optimization techniques
    • High-speed and low-power ICs for modern computing, communication, and consumer electronics
    • System-on-chip (SoC) design and integration for IoT, automotive, and healthcare applications
    • Microelectronics and nanoelectronics circuits for next-generation computing systems
    • Quantum computing circuits and hybrid systems involving semiconductors
    • Advanced packaging and interconnect technologies for integrated circuits
  4. Power Electronics and Energy Systems:
    • Power semiconductor devices for renewable energy systems, electric vehicles, and power grids
    • Semiconductor materials for energy-efficient devices, including energy harvesting and storage technologies
    • Power converters, inverters, and management circuits for energy systems
    • High-efficiency power management circuits for portable electronics and electric vehicles
    • Thermal management and reliability of power semiconductor devices in high-power applications
    • Semiconductor-based energy-efficient solutions for smart grids and smart cities
  5. Semiconductor Process Technology:
    • Advanced lithography, etching, and deposition technologies for semiconductor manufacturing
    • 3D integration and packaging technologies in semiconductor devices
    • Process scaling challenges and solutions for sub-nanometer semiconductor nodes
    • Emerging fabrication techniques such as atomic layer deposition (ALD) and molecular beam epitaxy (MBE)
    • Materials and process innovations for flexible, stretchable, and wearable electronics
    • Advanced metrology and inspection techniques for semiconductor fabrication and testing
  6. Circuit Design for Communication and Computing Systems:
    • RF and microwave circuits for wireless communication and radar systems
    • Semiconductor circuits for high-speed data processing and computing systems
    • Low-power and energy-efficient circuit design techniques for mobile and wearable devices
    • Circuit design for high-frequency and millimeter-wave communication systems
    • Fault-tolerant and error-correction circuits for robust semiconductor systems
    • Quantum circuits for quantum information processing and computing
  7. Semiconductor Nanotechnology and Quantum Devices:
    • Nanoscale semiconductor devices and their fabrication techniques
    • Quantum-dot-based devices and their applications in optoelectronics and quantum computing
    • Nanowire and 2D material-based semiconductor devices
    • Quantum computing hardware, including quantum processors and qubits
    • Quantum photonic circuits and their role in secure communication and sensing
    • Nanoelectronics for sensing and biosensing applications
  8. Semiconductor Circuits for Healthcare and Biomedical Applications:
    • Biomedical sensors and circuits for diagnostics and medical monitoring
    • Semiconductor-based wearable health devices and systems
    • Implantable devices and bioelectronics circuits for health applications
    • Integration of semiconductor circuits with biological systems for bioelectronics
    • Nanomedicine and semiconductor devices for drug delivery and bioimaging
    • Semiconductor devices in medical instrumentation and diagnostics
  9. Semiconductor Packaging and Reliability:
    • Advanced packaging techniques for semiconductors, including 3D stacking, flip-chip, and system-in-package (SiP)
    • Thermal management and cooling techniques in semiconductor packaging
    • Reliability testing and failure analysis of semiconductor devices and circuits
    • Packaging materials and their impact on device performance and lifetime
    • Interconnect technologies for high-performance and high-reliability systems
  10. Semiconductor Innovation and Future Trends:
    • Emerging trends in semiconductor technology and their impact on industries
    • Artificial intelligence and machine learning for semiconductor design and optimization
    • Semiconductor-driven innovations in autonomous systems, robotics, and AI hardware
    • Future semiconductor technologies for beyond-Moore’s law applications
    • Ethical and societal implications of semiconductor technologies
    • Industry 4.0 and the role of semiconductor technology in smart manufacturing and automation